CS ChipSettle EU chip-design settlement
← 🇪🇺 European Union
State aid scheme Active

European Chips Act (Regulation (EU) 2023/1781)

The EU framework mobilising up to €43bn to strengthen Europe's semiconductor ecosystem, built on three pillars: the Chips for Europe Initiative (R&D, design platform, pilot lines), a security-of-supply framework for first-of-a-kind facilities, and a monitoring/coordination structure.

3 Jul 2026

Key parameters

Mobilised investment Up to €43bn public + private
Pillar 1 Chips for Europe Initiative (via Chips JU) — €3.3bn EU funds
Pillar 2 First-of-a-kind Integrated Production Facilities & Open EU Foundries
Pillar 3 European Semiconductor Board + monitoring/crisis response

Eligibility

HQ
Any headquarters country
Local presence
Separate legal entity required The applicant must be a separate legal person (e.g. GmbH, BV, SARL) — a branch office of a foreign company does not qualify here.
R&D substance
Required
Company size
No size restriction
Models
All
Sectors
All
Goals
Additional design site in Europe; Manufacturing / fab site; Access to pilot lines & prototyping; R&D cooperation without own site

The Act is a framework: companies access it through Pillar-1 Chips JU calls and platform, or (for large fabs) Pillar-2 FOAK status enabling accelerated national state aid. An EU legal entity is required to contract.

Mechanism & application

Hybrid — Rule-based core with additional administrative steps.

Via Chips JU calls/platform (Pillar 1) or by applying for first-of-a-kind facility status (Pillar 2) with the Commission and member state.

Timeline: Pillar-dependent

Legal basis & sources

Legal basis
Regulation (EU) 2023/1781 (European Chips Act), OJ 18 Sep 2023
Source
https://digital-strategy.ec.europa.eu/en/policies/european-chips-act
Verification
EUR-Lex / EC digital-strategy (Reg. 2023/1781; €43bn; €3.3bn EU funds)
from 21 Sept 2023 until no expiry review 1 Dec 2026

Related